Pyrolytic Boron Nitride
Electrostatic Chuck

This is a PBN electrostatic chuck with heater (Pyrolytic Boron Nitride Electrostatic Chuck: PBN-ESC) manufactured using Shin-Etsu’s proprietary method.
Combining high-purity PBN produced via CVD method with our proprietary C-doped PBN technology, it delivers stable performance across a wide temperature range from room temperature to 800°C. It enables high-temperature processes unattainable with conventional electrostatic chucks, eliminating the need for ESC replacement across different operating temperatures.
Compatible with both Johnsen-Rahbek and Coulombic types, allowing selection of the optimal chucking method for your process requirements.

Structure of Pyrolytic Boron Nitride Electrostatic Chuck

Features

●Wide Temperature Range (Room Temp. to 800°C)
Our proprietary C-doped PBN technology enables stable chucking across a wide temperature range from room temperature to 800°C. It can be used across different temperature zones, significantly enhancing process flexibility.
●Supports wafers up to Φ330mm
From selecting graphite materials compatible with PBN to integrated manufacturing. Our proprietary coating technology enables production up to a maximum Φ330mm. We can also accommodate large 12-inch wafers.
●High-speed wafer heating
Reaches target temperature within approximately 10 seconds of chuck voltage application. Superior thermal conductivity characteristics allow for substantial reduction in process time, enhancing overall productivity.
●Excellent Temperature Uniformity
Advanced heating pattern formation technology and temperature distribution simulation enable wafer surface temperature control approximately ±2%. This achieves improved process reproducibility and yield enhancement.
●High purity
Each metallic impurity is less than 1ppm.
*Si is <5 ppm.
●Long-term stable performance
PBN’s excellent chemical stability and mechanical strength maintain stable performance over extended periods, even under harsh process conditions. Our proprietary special PG film deposition enhances adhesion of the overcoat layer to prevent delamination, while achieving flat temperature-resistivity characteristics.
●Selectable Chucking Types
Johnsen-Rahbek and Coulombic types are available.

Specifications

Services

●Custom Design
We design and manufacture PBN-ESC products with optimal shapes and specifications tailored to customer requirements. Using our in-house simulation technology, we provide products with high heat uniformity.
●Characterization Services
We maintain state-of-the-art inspection equipment including Thermography and TC wafers. We provide detailed temperature distribution data from our evaluation chamber to support process optimization.
●Repair (Refurbishment) Services
Leveraging years of experience and expertise, we remove process deposits and damage to restore components to like new condition.
Restoration capability depends on the extent of damage.

Applications

• Sputtering Equipment
• SiC Ion Implantation Equipment
• CVD Equipment
• Etching equipment (consultation required depending on gas type), etc.